† Corresponding author. E-mail:
Project supported by the National Key Technology R&D Program of China (Grant No. 2018YFA0209104), the Key R&D Program of Guangdong Province, China (Grant No. 2018B030329001), and the Major Program of the National Natural Science Foundation of China (Grant No. 61790581).
The eight-band
In recent years, the increasing applications of long-wave infrared (LWIR) detectors in numerous fields, especially in ballistic missile defense, remote sensing, and meteorological monitoring, have promoted the research and development of long-wave infrared detectors.[1] As the most widely used infrared detector to date, mercury cadmium telluride (MCT) is not a perfect material system due to the intrinsic shortcomings such as the poor uniformity of large area and the difficulty of alloy component adjustment.[2,3] After proposed by Sai-Halasz et al. in 1997, the InAs/GaSb superlattice with a type-II band gap alignment is considered as a promising alternative to the state-of-the-art MCT technology in the LWIR detection for its various advantages, like the adjustable band gap energy,[4–6] the low Auger recombination rate,[7] the large electron effective mass,[8] and the convenience of material growth and device preparation process.[9] In addition to the traditional p–n or p–i–n structure, there are a variety of heterojunction configurations of antimony-based type-II superlattice that is closely lattice matched to obtain lower dark current density and relatively higher device performance.
There are two most important indicators for measuring the performance of infrared detectors. One is the dark current density (resistance–area product), and the other is the quantum efficiency (QE). While the dark current density can be reduced by proper band engineering design and passivation process, there are many ways to improve the quantum efficiency, such as increasing the length of the absorption layer[10] and reducing the reflectivity of the material surface. Despite the investigations of the LWIR InAs/GaSb superlattice detector have made significant progress, there remains a challenge of how to reduce the dark current without decreasing the quantum efficiency.[11] Fortunately, with the presence of barrier structure inserted by a wide bandgap AlSb layer, the contradiction between reducing dark current and improving quantum efficiency is remarkably alleviated by the appropriate superlattice structure design.[12,13] Different from other literatures, this paper combines the two optimization methods of performance. First, the best long wave device structure is designed by band simulation. On the basis of this device structure, a series of devices are prepared to vary the doping concentration of beryllium in the absorption region, from which the infrared detection device with low dark current density and high quantum efficiency is obtained.
In this paper, we first design a LWIR P-π-M-N photodetector in terms of energy band. Then, we use the designed structure to carry out the experiment of the absorption region p-type doping with variable temperatures. Finally, we summarize the experiment and obtain the optimum temperature of Be doping in the absorption region.
In this work, we use the M-superlattice composed of InAs/GaSb/AlSb as a barrier layer to reduce the dark current of the LWIR device. In order to get the best LWIR device model, we design the energy bands of superlattice materials in the active layer and the barrier layer, respectively. We use the eight band
According to the band-edge energy of the device from Table
From the expression of detectivity, we can conclude that the effect of quantum efficiency on detectivity is actually greater than that of dark current, as the R0A term in the expression has an additional root sign. Therefore, this paper focuses on how to improve the quantum efficiency of LWIR devices by doping the active region. Quantum efficiency reflects the ability of incident photons to convert into photo-current, which is ought to include the optical absorption ability of materials, the transport of photo-generated carriers, and the collection efficiency of electrodes. Previous literatures have studied the variation of quantum efficiency with doping concentration in the active region on a series of VLWIR photodetectors with a cutoff wavelength of 21 μm.[11] Based on the previous experiments, this paper will explore the effect of doping in the active region on long-wave devices with cut-off wavelength of about 10.5 μm.
Assuming that the surface recombination rate is zero, the expression of the total external QE for a p–i–n detector is[16]
In order to better analyze the dominant dark current mechanism in the devices, we set up the dark current model of the detectors. In general, the dark current in the detector can be divided into bulk dark current and surface leakage current. Among them, the different components of the bulk dark current have analytical expression forms
Figure
In this work, we used a solid source Gen II molecular beam epitaxy (MBE) reactor to grow a series of superlattice photodetectors with an active region structure of 12 ML InAs/7 ML GaSb (SLs) with a cutoff wavelength of about 10.2 μm on an n-type GaSb (001) substrate. An InSb layer was grown between the InAs and GaSb. The structure consists of a 0.8 μm p+-doping GaSb buffer followed by a 0.5 μm InAs/GaSb SLs P+-region (Be doping concentration 1 × 1018 cm−3 in both regions). Then, a 3 μm 12 ML InAs/7 ML GaSb SLs active region was grown with different Be doping temperatures (760 °C, 780 °C, 800 °C, 820 °C). Next, a 0.5 μm 18 ML InAs/3 ML GaSb/5 ML AlSb/3 ML GaSb M-structure SLs was grown with a slightly Si doping concentration of 1× 1016 cm−3. Finally, a 20 mm n+ InAs cap was grown followed by a 0.5 μm N+-region M-structure SLs (Be: 1 × 1018 cm−3) with a similar structure of the previous barrier region. Four epitaxial wafers were grown in this experiment and except for the different doping temperatures of Be in the active region, the growth conditions were kept the same. All samples were processed and characterized in exactly the same way, using standard photo-lithography techniques. In order to suppress the surface leakage current, the surfaces of the all devices were passivated with SiO2. Each epitaxial wafer includes three mesa areas of side lengths of 117 μm, 167 μm, and 250 μm.
Figure
Figure
The J–V characteristic reflects the noise level of the detector. Figure
Figure
In order to explain the behavior of the dark current curve in Fig.
In a few words, the total dark current is the sum of bulk dark current and surface leakage current. In a small reverse bias, the dominant factor of the bulk dark current is the G–R current while tunneling dominates at large reverse voltage.
Based on the eight-band
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